Pentron Clinical Bond-It System is a 4th generation, total etch bonding system. The Bond-It System provides a bond strength of 29.4 MPa and virtually eliminates post-operative sensitivity. The bonding system's familiar technique and chemistry assures the ideal surface to which any restorative material may be bonded to direct or indirect composite, porcelain, metal and amalgam alloy.

Kit: 6 ml Primer A, 6 ml Primer B, 6 ml Resin Light-Cure, 3 ml Resin Dual-Cure Activator, 3 ml Syringe 10% Phosphoric Acid Etch Gel, 3 ml Syringe 37% Phosphoric Acid Etch Gel, 20 22-Gauge Bent Needle Tips

Resin Light-Cure & Dual Refill: 6 ml Resin Light-Cure, 3 ml Dual-Cure Activator

• Virtually eliminates post-operative sensitivity
• Familiar, easy to use, reliable system
• Proven technique over years of clinical use
• Ideal for bonding under amalgam