Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This versatile system can be used for all your bonding procedures. Bond-1 Primer/Adhesive has been proven to create the ideal sealed surface and interpenetrated network of the polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8µm.

Kit: 4 ml Primer/Adhesive, 3 ml Dual Cure Activator, 2 x 5 ml Syringe 37% Etch Gel

• Simple, time-saving and reliable bonding system
• High bond strength to both dentin and enamel
• Extremely versatile system
• Low film thickness assures the ideal surface to bond to restorative materials